3D stacking DRAM with PIM

The Memory-Driven Next-Generation AI Computing Architecture

【Core IC Design and Technology R&D】

ESMT’s aiPIM™ product is built upon forward-looking concepts in computer system architecture and semiconductor chip circuit design.

By leveraging advanced stacking technology, we integrate a dedicated AI computing logic layer (Base Die) with standard DRAM through a standard memory interface, enabling memory-centric AI computation.

This logic layer incorporates high-speed matrix and vector acceleration engines such as GEMV, allowing data to be processed rapidly within the memory and reducing unnecessary data movement.

With ESMT’s long-term research and development in computer hardware systems, aiPIM™ breaks through the traditional Von Neumann “memory wall” bottleneck and delivers significant improvements in energy efficiency and latency, especially for edge AI applications.

【Software Development and Data Processing Efficiency】

aiPIM™ is more than a hardware product— it is a complete hardware-software co-design platform.

Our team is committed to researching computer software technologies and developing SDKs and drivers that tightly integrate with the hardware, ensuring seamless compatibility with mainstream SoC platforms.

In data-processing program development, we focus on reducing data movement, optimizing in-memory computation flows, and enhancing the efficiency of AI inference.

We further strengthen the co-design between system architecture and data-processing workflows.

In addition, we provide complete and precise technical documentation to help customers understand the architecture quickly, accelerate development, and shorten time-to-market.

【Professional Consulting and Partnership Services】

As a leader and pioneer in aiPIM™ product, ESMT provides a wide range of semiconductor technical consulting and collaboration services.

Our technical team supports customers with semiconductor technology consulting, chip selection analysis, system architecture design, process integration guidance, and optimization of AI and in-memory computation workflows.

We also offer system-level optimization solutions tailored to customer requirements, including performance enhancement, power optimization, and memory-centric computation tuning.

Furthermore, ESMT serves as a strategic partner to co-develop new products with customers, leveraging the computational advantages of aiPIM™ product to create next-generation intelligent AI solutions.

3D stacking DRAM with PIM

記憶體驅動的次世代AI運算架構

【晶片設計與技術研發核心】

晶豪科技（ESMT）的 aiPIM™產品，建立在對電腦體系結構與半導體晶片積體電路設計的前瞻性思考之上。

藉由採用先進堆叠技術，我們將專用 AI 運算邏輯層（Base Die）與標準 DRAM 以標準記憶體介面整合，使記憶體本身具備 AI 運算能力。

此運算邏輯層整合高速矩陣與向量運算引擎（GEMV），可在記憶體內快速處理資料，顯著減少資料搬移需求。

我們長期在電腦硬體系統與產品創新研發的投入，使 aiPIM™ 得以突破傳統馮紐曼架構的記憶體牆瓶頸，大幅提升能效與延遲表現，特別適用於邊緣 AI 應用。

【軟體開發與資料處理效能】

aiPIM™ 不僅是一項硬體產品，更是一套軟硬體協同的完整平台。

我們專注於電腦軟體技術研究與開發，並設計與硬體深度整合的 SDK、驅動程式，確保 aiPIM™ 能與主流 SoC 平台順暢串接。

在資料處理電腦程序開發上，我們著重於降低資料搬移、最佳化記憶體內的運算流程、提升 AI 推論效率，並強化電腦體系結構與資料流程的協同設計。

此外，我們提供完整且精準的技術文件，協助客戶快速理解架構、加速開發並縮短產品上市時間。

【專業顧問與合作服務】

作為 aiPIM™產品的領導者與先驅，ESMT 提供多元的半導體專業諮詢與協作服務。

我們的技術團隊能提供半導體技術諮詢、晶片選型評估、系統架構設計、製程整合，以及 AI 與記憶體運算流程優化。

同時，我們亦能依據客戶應用需求提供系統級最佳化方案，如效能提升、功耗管理與記憶體運算架構調整。

ESMT 也能作為策略合作夥伴，與企業共同開發新產品，運用 aiPIM™ 產品具有的運算優勢打造次世代智慧 AI 解決方案。