EE Intelligent TechCon 2025
Elite Semiconductor Microelectronics Technology Inc (ESMT), a company dedicated to the development of Sub-GHz wireless communication technologies, will join the EE Intelligent TechCon 2025 from October 1 to 2, 2025 at Taipei New Horizon (Songshan Cultural and Creative Park, 6F). At booth J07, ESMT will showcase its latest Sub-GHz wireless communication solutions, highlighting the company’s innovative achievements and product advantages for the fast-growing field of IoT applications.
At the exhibition, ESMT will unveil its newest Sub-GHz SoC series, ER8130 and ER8200. These chips are specifically designed for long-range and low-power applications, offering excellent anti-interference performance and flexible RF parameter settings. They are particularly well-suited for IoT scenarios that demand stable data transmission and energy efficiency. ESMT’s SoC series support multiple communication protocols and are compatible with diverse module designs. ESMT also provide comprehensive development toolkits to help customers accelerate system integration and product deployment.
In addition, ESMT will present the ER81Wx series and ER41 transmission modules, which provide configurable wireless transmission capabilities. These modules allow users to adjust transmission settings according to real-world conditions such as distance, interference levels, and power requirements in order to optimize communication performance and system stability. The adaptability of these solutions make them ideal for applications including smart logistics and warehousing, asset tracking, and remote environmental monitoring.
As IoT applications continue to expand and demand for reliable transmission solutions grows rapidly, ESMT is committed to advancing diverse communication technologies that enhance system performance and operational efficiency. We look forward to engaging with industry partners at the 2025 EE Tech Forward Conference to explore new opportunities for smart applications.
ESMT sincerely invites industry professionals and partners to visit Booth J07 to experience the latest product demonstrations and discuss potential opportunities for technological collaboration and business development.
