Mixed Signal IC
Wireless Connectivity
BLDC Motor Driver Application
Sensor and Mixed-Signal Processing IC
Optical Electric Development
Audio Amplifier
Low Power Class D
Analog Input High Power Class D
Non-EQ Digital Input High Power Class D
with EQ Digital Input High Power Class D
Audio ADC DAC
Audio Line Driver
USB Audio
MEMS Microphones
Digital/Analog/Smart MIC series
MEMS (Micro-Electro-Mechanical Systems) microphones utilize semiconductor manufacturing technology to create miniature devices with electro-mechanical functionality. They offer superior tolerance to high temperatures and high-frequency noise, allowing for integration into highly complex designs without concerns regarding noise interference. Silicon-based MEMS microphones enable the seamless integration of MEMS structures with ASIC, resulting in a significant reduction in component size. Their ultra-compact dimensions align with the ongoing trend toward thinner and smaller designs in consumer electronics.
Basic Operating Principle
1. Sound Entry: Sound pressure (air vibration) enters the microphone through tiny holes in the housing (top or bottom ports).
2. Structural Displacement: Sound waves strike an internal, ultra-lightweight movable diaphragm, causing it to vibrate mechanically.
3. Signal Conversion:
3.a. Captive (most common): A capacitor is formed between the diaphragm and a fixed backplate. As the diaphragm vibrates, the distance between the two changes, causing the capacitance value to fluctuate.
3.b. Piezoelectric: The diaphragm utilizes piezoelectric material, directly converting the deformation caused by applied force into electrical energy.
4. Signal Amplification and Output: Since the change in capacitance is minute, an internal ASIC (Application-Specific Integrated Circuit) chip is typically used to convert and amplify these subtle changes into an analog or digital (like PDM/I2S interface) electrical signal output.
Key Advantages
1. Compact Size and High Integration: Combines the semiconductor and preamplifier; ideal for multi-microphone arrays and compact devices.
2. High-Temperature Resistance: Supports Surface Mount Technology (SMT) and automated reflow soldering.
3. Excellent Consistency: High temperature stability and uniform performance.
Bone Conduction Microphones (BCM)
BCM series
A Bone Conduction Microphone (BCM) is a specialized acoustic transducer that captures sound waves and voice signals through the bones of the user's skull or facial structure rather than through the surrounding air. Unlike traditional air-conduction microphones, it directly detects vocal cord and tissue vibrations, making it highly effective at isolating speech and reducing background noise in loud environments. It is widely used in tactical communications, smart wearable and TWS (True Wireless Stereo) earbuds.
Electret Condenser Microphones (ECM)
ECM series
The Electret Condenser Microphone (ECM) is a mature audio technology that utilizes a permanently charged electret material to store an electric charge and generates signals by varying capacitance through vibration.
Working Principle
1. Electret Characteristics: It employs an electret internally—a type of ferroelectric material capable of permanently retaining an electric charge—thereby providing a fixed charge without the need for an external high-voltage polarization source.
2. Capacitance Variation: When sound waves cause the thin diaphragm to vibrate, the distance between the diaphragm and the backplate changes; this alters the capacitance and converts the acoustic energy into an electrical signal.
Advantages and Disadvantages
1. Advantages: Low cost and highly mature technology; compact size, stable sensitivity, and wide frequency response.
2. Disadvantages: The structure is relatively delicate, making it sensitive to high sound pressure levels or severe physical impact. It is susceptible to environmental noise (such as fan noise), and its heat resistance is somewhat inferior to that of MEMS microphones regarding modern automated Surface Mount Technology (SMT) manufacturing processes.
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