Multi-chip Memory

MCP (Multi‑Chip Package) integrates NAND Flash, LPDDR memory, and a controller into a single BGA chip, resulting in a compact footprint and low power consumption, which simplifies board layout and firmware development.
ESMT offers a variety of NAND + LPDDR2/LPDDR4x capacity combinations, providing flexible solutions to meet diverse requirements.

eMMC (embedded MultiMediaCard) packages NAND Flash and a controller into a single BGA chip. It offers the advantages of small size, low power consumption, and simplified system design.
ESMT provides densities ranging from 4 GB to 64 GB.