Mixed Signal IC
Wireless Connectivity
BLDC Motor Driver Application
Sensor and Mixed-Signal Processing IC
Optical Electric Development
MCP (Multi‑Chip Package) integrates NAND Flash, LPDDR memory, and a controller into a single BGA chip, resulting in a compact footprint and low power consumption, which simplifies board layout and firmware development.
ESMT offers a variety of NAND + LPDDR2/LPDDR4x capacity combinations, providing flexible solutions to meet diverse requirements.
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