ESMT

Serial NOR delivers high‑speed, stable execution performance for the system, and its low‑latency access architecture enables instant boot and continuous, reliable operation.
The product line spans the full capacity range from 1 Mb to 512 Mb and supports both 1.8 V and 3.3 V voltage specifications, meeting diverse power‑consumption and interface requirements.
ESMT offers a KGD (Known‑Good‑Die) solution that guarantees high yield and long‑term reliability, giving system designers greater flexibility and security.

LPDDR2 builds on LPDDR by adding a 4x prefetch and operating at 1.2 V–1.8 V, achieving data rates up to 533 MHz.
It includes auto‑refresh and low‑power standby modes, delivering both high performance and energy efficiency for IoT and industrial control systems.
Available in 512 Mb‑4Gb configurations and compatible with a wide range of SoCs and platforms, LPDDR2 meets the needs of mid‑ to high‑end mobile and embedded applications.

LPDDR4 is the latest low‑power memory generation, operating at an ultra‑low 1.2 V with a 16x prefetch and Bank‑Group architecture that reaches data rates up to 2133 MHz while markedly lowering unit power consumption.
Integrated data registers enhance system stability. Target applications include 5G smartphones, automotive infotainment, AI edge devices, and high‑performance servers.
ESMT product line provides 4 Gb and 8 Gb options, offering flexible design and long‑term reliability for the most demanding performance‑and‑efficiency workloads.

Parallel NAND is designed for high‑throughput applications, using a multi‑channel parallel‑access architecture that significantly increases read and write speeds.
It delivers a reliable, efficient storage solution for large‑capacity use cases.

Targeting data‑storage needs, Serial NAND delivers high‑speed serial transfer and low‑power operation. Its built‑in ECC error‑correction provides long‑term, secure data protection even during rapid writes.
Its compact WSON 6 × 8 mm package dramatically reduces PCB area, making circuit designs simpler and more cost‑effective.

MCP (Multi‑Chip Package) integrates NAND Flash, LPDDR memory, and a controller into a single BGA chip, resulting in a compact footprint and low power consumption, which simplifies board layout and firmware development.
ESMT offers a variety of NAND + LPDDR2/LPDDR4x capacity combinations, providing flexible solutions to meet diverse requirements.

eMMC (embedded MultiMediaCard) packages NAND Flash and a controller into a single BGA chip. It offers the advantages of small size, low power consumption, and simplified system design.
ESMT provides densities ranging from 4 GB to 64 GB.