ESMT

Serial NOR delivers high‑speed, stable execution performance for the system, and its low‑latency access architecture enables instant boot and continuous, reliable operation.
The product line spans the full capacity range from 1 Mb to 512 Mb and supports both 1.8 V and 3.3 V voltage specifications, meeting diverse power‑consumption and interface requirements.
ESMT offers a KGD (Known‑Good‑Die) solution that guarantees high yield and long‑term reliability, giving system designers greater flexibility and security.

DDR3 employs an 8× prefetch and runs at 1.5 V (or 1.35 V low‑power) with frequencies that can surpass 933 MHz, delivering nearly double the performance of DDR2 while further reducing power draw.
Its high bandwidth, on‑chip self‑calibration, and data‑masking features enable outstanding performance in embedded systems, network peripherals, and low-end personal computers platforms.
Available capacities range from 512 Mb to 8Gb, and the devices are compatible with many SoCs and motherboards, providing a solid foundation for high‑performance, energy‑saving designs.

DDR4 represents the latest generation of mobile and server memory, operating at an ultra‑low 1.2 V and supporting speeds of 1600 MHz and higher.
With an even larger prefetch depth and substantially lower per‑bit power consumption, DDR4 also incorporates on‑die data registration, which together boost system stability and data integrity.
These attributes make DDR4 well‑suited for automotive infotainment systems, network cameras, and Wi‑Fi 7 routers.
The portfolio includes a 4 Gb part that offers flexible design options and long‑term reliability guarantees.

LPDDR3 employs an 8x prefetch and runs at 1.5 V (or 1.35 V low‑power variant), providing a substantial performance jump over its predecessor while further reducing power draw.
Built‑in self‑calibration and data‑masking improve data reliability, making it suited for tablets and high‑end embedded platforms.
Capacities of 1 Gb and 4 Gb are offered, with support for multiple memory controllers, delivering the high‑bandwidth, low‑power foundation required by today's mobile devices.

MCP (Multi‑Chip Package) integrates NAND Flash, LPDDR memory, and a controller into a single BGA chip, resulting in a compact footprint and low power consumption, which simplifies board layout and firmware development.
ESMT offers a variety of NAND + LPDDR2/LPDDR4x capacity combinations, providing flexible solutions to meet diverse requirements.

eMMC (embedded MultiMediaCard) packages NAND Flash and a controller into a single BGA chip. It offers the advantages of small size, low power consumption, and simplified system design.
ESMT provides densities ranging from 4 GB to 64 GB.